UFDFN-20.kicad_mod
3.18 KB
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(module UFDFN-20 (layer F.Cu) (tedit 5961E9CF)
(descr UFDFN-20)
(tags UFDFN-20)
(attr smd)
(fp_text reference >NAME (at -2.794 0 90) (layer F.SilkS)
(effects (font (size 0.6096 0.6096) (thickness 0.127)))
)
(fp_text value >VALUE (at 2.794 0 90) (layer F.SilkS)
(effects (font (size 0.6096 0.6096) (thickness 0.127)))
)
(fp_circle (center -2.286 1.905) (end -2.159 1.905) (layer F.SilkS) (width 0.254))
(fp_line (start 2.14884 -1.02362) (end 2.14884 1.02362) (layer F.SilkS) (width 0.2032))
(fp_line (start -2.14884 -1.02362) (end -2.14884 1.02362) (layer F.SilkS) (width 0.2032))
(fp_circle (center -2.54 1.27) (end -2.54 1.016) (layer F.SilkS) (width 0))
(pad 1 smd rect (at -1.79832 0.84836 90) (size 1.09982 0.19812) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 2 smd rect (at -1.39954 0.89916 90) (size 0.99822 0.19812) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 3 smd rect (at -0.99822 0.89916 90) (size 0.99822 0.19812) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 4 smd rect (at -0.59944 0.89916 90) (size 0.99822 0.19812) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 5 smd rect (at -0.19812 0.89916 90) (size 0.99822 0.19812) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 6 smd rect (at 0.19812 0.89916 90) (size 0.99822 0.19812) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 7 smd rect (at 0.59944 0.89916 90) (size 0.99822 0.19812) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 8 smd rect (at 0.99822 0.89916 90) (size 0.99822 0.19812) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 9 smd rect (at 1.39954 0.89916 90) (size 0.99822 0.19812) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 10 smd rect (at 1.79832 0.89916 90) (size 0.99822 0.19812) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 11 smd rect (at 1.79832 -0.89916 90) (size 0.99822 0.19812) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 12 smd rect (at 1.39954 -0.89916 90) (size 0.99822 0.19812) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 13 smd rect (at 0.99822 -0.89916 90) (size 0.99822 0.19812) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 14 smd rect (at 0.59944 -0.89916 90) (size 0.99822 0.19812) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 15 smd rect (at 0.19812 -0.89916 90) (size 0.99822 0.19812) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 16 smd rect (at -0.19812 -0.89916 90) (size 0.99822 0.19812) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 17 smd rect (at -0.59944 -0.89916 90) (size 0.99822 0.19812) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 18 smd rect (at -0.99822 -0.89916 90) (size 0.99822 0.19812) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 19 smd rect (at -1.39954 -0.89916 90) (size 0.99822 0.19812) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 20 smd rect (at -1.79832 -0.89916 90) (size 0.99822 0.19812) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
)