(module UFDFN-20 (layer F.Cu) (tedit 5961E9CF)
  (descr UFDFN-20)
  (tags UFDFN-20)
  (attr smd)
  (fp_text reference >NAME (at -2.794 0 90) (layer F.SilkS)
    (effects (font (size 0.6096 0.6096) (thickness 0.127)))
  )
  (fp_text value >VALUE (at 2.794 0 90) (layer F.SilkS)
    (effects (font (size 0.6096 0.6096) (thickness 0.127)))
  )
  (fp_circle (center -2.286 1.905) (end -2.159 1.905) (layer F.SilkS) (width 0.254))
  (fp_line (start 2.14884 -1.02362) (end 2.14884 1.02362) (layer F.SilkS) (width 0.2032))
  (fp_line (start -2.14884 -1.02362) (end -2.14884 1.02362) (layer F.SilkS) (width 0.2032))
  (fp_circle (center -2.54 1.27) (end -2.54 1.016) (layer F.SilkS) (width 0))
  (pad 1 smd rect (at -1.79832 0.84836 90) (size 1.09982 0.19812) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad 2 smd rect (at -1.39954 0.89916 90) (size 0.99822 0.19812) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad 3 smd rect (at -0.99822 0.89916 90) (size 0.99822 0.19812) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad 4 smd rect (at -0.59944 0.89916 90) (size 0.99822 0.19812) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad 5 smd rect (at -0.19812 0.89916 90) (size 0.99822 0.19812) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad 6 smd rect (at 0.19812 0.89916 90) (size 0.99822 0.19812) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad 7 smd rect (at 0.59944 0.89916 90) (size 0.99822 0.19812) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad 8 smd rect (at 0.99822 0.89916 90) (size 0.99822 0.19812) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad 9 smd rect (at 1.39954 0.89916 90) (size 0.99822 0.19812) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad 10 smd rect (at 1.79832 0.89916 90) (size 0.99822 0.19812) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad 11 smd rect (at 1.79832 -0.89916 90) (size 0.99822 0.19812) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad 12 smd rect (at 1.39954 -0.89916 90) (size 0.99822 0.19812) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad 13 smd rect (at 0.99822 -0.89916 90) (size 0.99822 0.19812) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad 14 smd rect (at 0.59944 -0.89916 90) (size 0.99822 0.19812) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad 15 smd rect (at 0.19812 -0.89916 90) (size 0.99822 0.19812) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad 16 smd rect (at -0.19812 -0.89916 90) (size 0.99822 0.19812) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad 17 smd rect (at -0.59944 -0.89916 90) (size 0.99822 0.19812) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad 18 smd rect (at -0.99822 -0.89916 90) (size 0.99822 0.19812) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad 19 smd rect (at -1.39954 -0.89916 90) (size 0.99822 0.19812) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad 20 smd rect (at -1.79832 -0.89916 90) (size 0.99822 0.19812) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
)