QFN-24.kicad_mod 4.1 KB
(module QFN-24 (layer F.Cu) (tedit 5961CF6F)
  (descr "24-PIN QFN (4 X 4 MM) (1:1 FOOTPRINT)")
  (tags "24-PIN QFN (4 X 4 MM) (1:1 FOOTPRINT)")
  (attr smd)
  (fp_text reference >NAME (at 0 -3.048) (layer F.SilkS)
    (effects (font (size 0.6096 0.6096) (thickness 0.127)))
  )
  (fp_text value >VALUE (at 0 3.175) (layer F.SilkS)
    (effects (font (size 0.6096 0.6096) (thickness 0.127)))
  )
  (fp_circle (center -2.159 -2.286) (end -2.032 -2.286) (layer F.SilkS) (width 0.254))
  (fp_line (start 1.64846 2.06248) (end 2.06248 2.06248) (layer F.SilkS) (width 0.2032))
  (fp_line (start 2.06248 1.64846) (end 2.06248 2.06248) (layer F.SilkS) (width 0.2032))
  (fp_line (start -1.64846 2.06248) (end -2.06248 2.06248) (layer F.SilkS) (width 0.2032))
  (fp_line (start -2.06248 2.06248) (end -2.06248 1.64846) (layer F.SilkS) (width 0.2032))
  (fp_line (start 2.06248 -1.64846) (end 2.06248 -2.06248) (layer F.SilkS) (width 0.2032))
  (fp_line (start 2.06248 -2.06248) (end 1.64846 -2.06248) (layer F.SilkS) (width 0.2032))
  (fp_line (start -1.71196 -2.06248) (end -2.06248 -1.71196) (layer F.SilkS) (width 0.2032))
  (fp_circle (center -2.286 -2.286) (end -2.286 -2.54) (layer F.SilkS) (width 0))
  (pad 1 smd oval (at -2.07518 -1.30048 180) (size 0.889 0.2794) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad 2 smd oval (at -2.07518 -0.7747 180) (size 0.889 0.2794) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad 3 smd oval (at -2.07518 -0.24892 180) (size 0.889 0.2794) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad 4 smd oval (at -2.10058 0.24892 180) (size 0.889 0.2794) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad 5 smd oval (at -2.07518 0.7747 180) (size 0.889 0.2794) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad 6 smd oval (at -2.07518 1.30048 180) (size 0.889 0.2794) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad 7 smd oval (at -1.30048 2.07518 90) (size 0.889 0.2794) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad 8 smd oval (at -0.7747 2.07518 90) (size 0.889 0.2794) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad 9 smd oval (at -0.24892 2.07518 90) (size 0.889 0.2794) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad 10 smd oval (at 0.24892 2.07518 90) (size 0.889 0.2794) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad 11 smd oval (at 0.7747 2.07518 90) (size 0.889 0.2794) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad 12 smd oval (at 1.30048 2.07518 90) (size 0.889 0.2794) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad 13 smd oval (at 2.07518 1.30048) (size 0.889 0.2794) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad 14 smd oval (at 2.07518 0.7747) (size 0.889 0.2794) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad 15 smd oval (at 2.07518 0.24892) (size 0.889 0.2794) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad 16 smd oval (at 2.07518 -0.24892) (size 0.889 0.2794) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad 17 smd oval (at 2.07518 -0.7747) (size 0.889 0.2794) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad 18 smd oval (at 2.07518 -1.30048) (size 0.889 0.2794) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad 19 smd oval (at 1.30048 -2.07518 270) (size 0.889 0.2794) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad 20 smd oval (at 0.7747 -2.07518 270) (size 0.889 0.2794) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad 21 smd oval (at 0.24892 -2.07518 270) (size 0.889 0.2794) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad 22 smd oval (at -0.24892 -2.07518 270) (size 0.889 0.2794) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad 23 smd oval (at -0.7747 -2.07518 270) (size 0.889 0.2794) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad 24 smd oval (at -1.30048 -2.07518 270) (size 0.889 0.2794) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
)