LFCSP_20.kicad_mod
3.44 KB
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(module LFCSP_20 (layer F.Cu) (tedit 5961C7B4)
(attr smd)
(fp_text reference >NAME (at 0 -3.175) (layer F.SilkS)
(effects (font (size 0.8128 0.8128) (thickness 0.1524)))
)
(fp_text value >VALUE (at 0 3.175) (layer F.SilkS)
(effects (font (size 0.8128 0.8128) (thickness 0.1524)))
)
(fp_circle (center -2.667 -2.667) (end -2.413 -2.667) (layer F.SilkS) (width 0.254))
(fp_line (start 2.2479 -2.2479) (end -2.2479 -2.2479) (layer Dwgs.User) (width 0.2032))
(fp_line (start -2.2479 -2.2479) (end -2.2479 2.2479) (layer Dwgs.User) (width 0.2032))
(fp_line (start -2.2479 2.2479) (end 2.2479 2.2479) (layer Dwgs.User) (width 0.2032))
(fp_line (start 2.2479 2.2479) (end 2.2479 -2.2479) (layer Dwgs.User) (width 0.2032))
(fp_circle (center -1.7272 -1.69926) (end -1.7272 -1.9812) (layer Dwgs.User) (width 0))
(pad 1 smd rect (at -1.84912 -0.99822 270) (size 0.24892 0.49784) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 2 smd rect (at -1.84912 -0.49784 270) (size 0.24892 0.49784) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 3 smd rect (at -1.84912 0 270) (size 0.24892 0.49784) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 4 smd rect (at -1.84912 0.49784 270) (size 0.24892 0.49784) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 5 smd rect (at -1.84912 0.99822 270) (size 0.24892 0.49784) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 6 smd rect (at -0.99822 1.84912) (size 0.24892 0.49784) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 7 smd rect (at -0.49784 1.84912) (size 0.24892 0.49784) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 8 smd rect (at 0 1.84912) (size 0.24892 0.49784) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 9 smd rect (at 0.49784 1.84912) (size 0.24892 0.49784) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 10 smd rect (at 0.99822 1.84912) (size 0.24892 0.49784) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 11 smd rect (at 1.84912 0.99822 90) (size 0.24892 0.49784) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 12 smd rect (at 1.84912 0.49784 90) (size 0.24892 0.49784) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 13 smd rect (at 1.84912 0 90) (size 0.24892 0.49784) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 14 smd rect (at 1.84912 -0.49784 90) (size 0.24892 0.49784) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 15 smd rect (at 1.84912 -0.99822 90) (size 0.24892 0.49784) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 16 smd rect (at 0.99822 -1.84912 180) (size 0.24892 0.49784) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 17 smd rect (at 0.49784 -1.84912 180) (size 0.24892 0.49784) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 18 smd rect (at 0 -1.84912 180) (size 0.24892 0.49784) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 19 smd rect (at -0.49784 -1.84912 180) (size 0.24892 0.49784) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 20 smd rect (at -0.99822 -1.84912 180) (size 0.24892 0.49784) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad PAD smd rect (at 0 0) (size 2.49936 2.49936) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016) (solder_paste_margin -0.762))
)