MICRO-SD-SOCKET-SDIO.kicad_mod
3.22 KB
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(module MICRO-SD-SOCKET-SDIO (layer F.Cu) (tedit 5963E885)
(attr smd)
(fp_text reference >NAME (at -0.635 -2.54 90) (layer F.SilkS)
(effects (font (size 0.6096 0.6096) (thickness 0.127)))
)
(fp_text value >VALUE (at 14.605 -2.54 90) (layer F.SilkS)
(effects (font (size 0.6096 0.6096) (thickness 0.127)))
)
(fp_line (start -0.02794 0) (end -0.02794 -13.19784) (layer F.SilkS) (width 0.2032))
(fp_line (start 13.97 -12.09802) (end 13.97 0) (layer F.SilkS) (width 0.2032))
(fp_line (start 2.26822 -15.29842) (end 1.46812 -15.29842) (layer F.SilkS) (width 0.2032))
(fp_line (start 2.96926 -15.99946) (end 13.97 -15.99946) (layer Dwgs.User) (width 0.2032))
(fp_line (start 3.96748 -13.59916) (end 12.3698 -13.59916) (layer F.SilkS) (width 0.2032))
(fp_line (start -0.02794 0) (end 4.86918 0) (layer F.SilkS) (width 0.2032))
(fp_line (start 10.56894 0) (end 7.5692 0) (layer F.SilkS) (width 0.2032))
(fp_line (start 13.97 0) (end 13.26896 0) (layer F.SilkS) (width 0.2032))
(fp_line (start 13.97 -17.59966) (end 2.96926 -17.59966) (layer Dwgs.User) (width 0.2032))
(fp_line (start 13.97 -20.69846) (end 2.96926 -20.69846) (layer Dwgs.User) (width 0.2032))
(fp_arc (start 2.31902 -14.64818) (end 2.26822 -15.29842) (angle 98.7) (layer F.SilkS) (width 0.2032))
(fp_arc (start 3.99288 -14.62278) (end 3.96748 -13.59916) (angle 87.2) (layer F.SilkS) (width 0.2032))
(fp_text user Pressed (at 19.05 -16.51) (layer Dwgs.User)
(effects (font (size 1.27 1.27) (thickness 0.127)))
)
(fp_text user Locked (at 18.415 -18.415) (layer Dwgs.User)
(effects (font (size 1.27 1.27) (thickness 0.127)))
)
(fp_text user Unlocked (at 19.685 -21.59) (layer Dwgs.User)
(effects (font (size 1.27 1.27) (thickness 0.127)))
)
(pad CD/D smd rect (at 6.12902 -10.2997) (size 0.79756 1.4986) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad CD1 smd rect (at 11.91768 -0.39878) (size 1.79832 1.39954) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad CD2 smd rect (at 6.21792 -0.39878) (size 1.79832 1.39954) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad CLK smd rect (at 9.42848 -10.69848) (size 0.79756 1.4986) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad CMD smd rect (at 7.22884 -10.69848) (size 0.79756 1.4986) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad DAT0 smd rect (at 11.62812 -10.69848) (size 0.79756 1.4986) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad DAT1 smd rect (at 12.72794 -10.69848) (size 0.79756 1.4986) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad DAT2 smd rect (at 5.0292 -10.69848) (size 0.79756 1.4986) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad GND smd rect (at 10.5283 -10.89914) (size 0.79756 1.4986) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad GND1 smd rect (at 0.3683 -14.54912) (size 1.39954 1.89992) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad GND3 smd rect (at 13.51788 -13.54836) (size 1.39954 1.89992) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad VCC smd rect (at 8.32866 -10.89914) (size 0.79756 1.4986) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
)