TSSOP28.kicad_mod
4.42 KB
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(module TSSOP28 (layer F.Cu) (tedit 5961E99F)
(attr smd)
(fp_text reference >NAME (at 0 -5.842) (layer F.SilkS)
(effects (font (size 0.6096 0.6096) (thickness 0.127)))
)
(fp_text value >VALUE (at 0 5.207) (layer F.SilkS)
(effects (font (size 0.6096 0.6096) (thickness 0.127)))
)
(fp_circle (center -2.794 -5.207) (end -2.667 -5.207) (layer F.SilkS) (width 0.254))
(fp_line (start -2.27584 4.5593) (end 2.27584 4.5593) (layer Dwgs.User) (width 0.127))
(fp_line (start 2.27584 4.5593) (end 2.27584 -5.2197) (layer Dwgs.User) (width 0.127))
(fp_line (start 2.27584 -5.2197) (end -2.27584 -5.2197) (layer Dwgs.User) (width 0.127))
(fp_line (start -2.27584 -5.2197) (end -2.27584 4.5593) (layer Dwgs.User) (width 0.127))
(fp_line (start -2.27584 -5.2197) (end 2.27584 -5.2197) (layer F.SilkS) (width 0.127))
(fp_line (start 2.27584 -5.2197) (end 2.27584 4.5593) (layer F.SilkS) (width 0.127))
(fp_line (start 2.27584 4.5593) (end -2.27584 4.5593) (layer F.SilkS) (width 0.127))
(fp_line (start -2.27584 4.5593) (end -2.27584 -5.2197) (layer F.SilkS) (width 0.127))
(pad 1 smd rect (at -2.921 -4.6228) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 2 smd rect (at -2.921 -3.9624) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 3 smd rect (at -2.921 -3.302) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 4 smd rect (at -2.921 -2.6416) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 5 smd rect (at -2.921 -1.9812) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 6 smd rect (at -2.921 -1.3208) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 7 smd rect (at -2.921 -0.6604) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 8 smd rect (at -2.92608 0) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 9 smd rect (at -2.921 0.6604) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 10 smd rect (at -2.921 1.3208) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 11 smd rect (at -2.921 1.9812) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 12 smd rect (at -2.921 2.6416) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 13 smd rect (at -2.921 3.302) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 14 smd rect (at -2.921 3.9624) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 15 smd rect (at 2.921 3.9624) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 16 smd rect (at 2.921 3.302) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 17 smd rect (at 2.921 2.6416) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 18 smd rect (at 2.921 1.9812) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 19 smd rect (at 2.921 1.3208) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 20 smd rect (at 2.921 0.6604) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 21 smd rect (at 2.92608 0) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 22 smd rect (at 2.921 -0.6604) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 23 smd rect (at 2.921 -1.3208) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 24 smd rect (at 2.921 -1.9812) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 25 smd rect (at 2.921 -2.6416) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 26 smd rect (at 2.921 -3.302) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 27 smd rect (at 2.921 -3.9624) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 28 smd rect (at 2.921 -4.6228) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
)