QFN-8_PAD.kicad_mod
3.01 KB
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(module QFN-8_PAD (layer F.Cu) (tedit 5961DE75)
(attr smd)
(fp_text reference >NAME (at -2.54 0 90) (layer F.SilkS)
(effects (font (size 0.6096 0.6096) (thickness 0.127)))
)
(fp_text value >VALUE (at 2.54 0 90) (layer F.SilkS)
(effects (font (size 0.6096 0.6096) (thickness 0.127)))
)
(fp_circle (center -1.778 1.778) (end -1.651 1.778) (layer F.SilkS) (width 0.254))
(fp_line (start -1.5748 -1.5748) (end 1.5748 -1.5748) (layer Dwgs.User) (width 0.02794))
(fp_line (start 1.5748 -1.5748) (end 1.5748 1.5748) (layer Dwgs.User) (width 0.02794))
(fp_line (start 1.5748 1.5748) (end -1.5748 1.56464) (layer Dwgs.User) (width 0.02794))
(fp_line (start -1.5748 1.56464) (end -1.5748 -1.5748) (layer Dwgs.User) (width 0.02794))
(fp_line (start -1.27 -1.5875) (end -1.5875 -1.5875) (layer F.SilkS) (width 0.2032))
(fp_line (start -1.5875 -1.5875) (end -1.5875 -0.635) (layer F.SilkS) (width 0.2032))
(fp_line (start 1.27 -1.5875) (end 1.5875 -1.5875) (layer F.SilkS) (width 0.2032))
(fp_line (start 1.5875 -1.5875) (end 1.5875 -0.635) (layer F.SilkS) (width 0.2032))
(fp_line (start 1.5875 0.635) (end 1.5875 1.5875) (layer F.SilkS) (width 0.2032))
(fp_line (start 1.5875 1.5875) (end 1.27 1.5875) (layer F.SilkS) (width 0.2032))
(fp_line (start -1.27 1.5875) (end -1.5875 1.27) (layer F.SilkS) (width 0.2032))
(fp_line (start -1.5875 1.27) (end -1.5875 0.635) (layer F.SilkS) (width 0.2032))
(pad 1 smd rect (at -0.97282 1.4732 90) (size 0.84836 0.34798) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 2 smd rect (at -0.32258 1.4732 90) (size 0.84836 0.34798) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 3 smd rect (at 0.32258 1.4732 90) (size 0.84836 0.34798) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 4 smd rect (at 0.97282 1.4732 90) (size 0.84836 0.34798) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 5 smd rect (at 0.97282 -1.4732 90) (size 0.84836 0.34798) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 6 smd rect (at 0.32258 -1.4732 90) (size 0.84836 0.34798) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 7 smd rect (at -0.32258 -1.4732 90) (size 0.84836 0.34798) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 8 smd rect (at -0.97282 -1.4732 270) (size 0.84836 0.34798) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 9 smd rect (at 0 0 90) (size 1.4986 1.74752) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 10 smd rect (at -1.38684 0.32258 180) (size 1.02362 0.2794) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 11 smd rect (at 1.38684 0.32258 180) (size 1.02362 0.2794) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 12 smd rect (at 1.38684 -0.32258 180) (size 1.02362 0.2794) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad 13 smd rect (at -1.38684 -0.32258 180) (size 1.02362 0.2794) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
)