DIL40_0.9.kicad_mod 6.38 KB
(module DIL40_0.9 (layer F.Cu) (tedit 5962ECC9)
  (descr "DUAL INLINE 40 PIN PACKAGE FOR MBED MICROCONTROLLER DEVELOPMENT PLATFORM.")
  (tags "DUAL INLINE 40 PIN PACKAGE FOR MBED MICROCONTROLLER DEVELOPMENT PLATFORM.")
  (attr virtual)
  (fp_text reference >NAME (at -22.86 -8.89 180) (layer F.SilkS)
    (effects (font (size 0.6096 0.6096) (thickness 0.127)))
  )
  (fp_text value >VALUE (at -22.86 8.89) (layer F.SilkS)
    (effects (font (size 0.6096 0.6096) (thickness 0.127)))
  )
  (fp_line (start -25.4 13.97) (end -25.4 3.81) (layer F.SilkS) (width 0.127))
  (fp_line (start -25.4 3.81) (end -25.4 -3.81) (layer F.SilkS) (width 0.127))
  (fp_line (start -25.4 -3.81) (end -25.4 -13.97) (layer F.SilkS) (width 0.127))
  (fp_line (start -25.4 -13.97) (end 27.94 -13.97) (layer F.SilkS) (width 0.127))
  (fp_line (start 27.94 -13.97) (end 27.94 13.97) (layer F.SilkS) (width 0.127))
  (fp_line (start 27.94 13.97) (end -25.4 13.97) (layer F.SilkS) (width 0.127))
  (fp_line (start -25.4 -3.81) (end -16.51 -3.81) (layer F.SilkS) (width 0.127))
  (fp_line (start -16.51 -3.81) (end -16.51 3.81) (layer F.SilkS) (width 0.127))
  (fp_line (start -16.51 3.81) (end -25.4 3.81) (layer F.SilkS) (width 0.127))
  (pad 1 thru_hole circle (at -22.86 11.43) (size 1.397 2.794) (drill 0.99822) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad 2 thru_hole circle (at -20.32 11.43) (size 1.397 2.794) (drill 0.99822) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad 3 thru_hole circle (at -17.78 11.43) (size 1.397 2.794) (drill 0.99822) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad 4 thru_hole circle (at -15.24 11.43) (size 1.397 2.794) (drill 0.99822) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad 5 thru_hole circle (at -12.7 11.43) (size 1.397 2.794) (drill 0.99822) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad 6 thru_hole circle (at -10.16 11.43) (size 1.397 2.794) (drill 0.99822) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad 7 thru_hole circle (at -7.62 11.43) (size 1.397 2.794) (drill 0.99822) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad 8 thru_hole circle (at -5.08 11.43) (size 1.397 2.794) (drill 0.99822) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad 9 thru_hole circle (at -2.54 11.43) (size 1.397 2.794) (drill 0.99822) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad 10 thru_hole circle (at 0 11.43) (size 1.397 2.794) (drill 0.99822) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad 11 thru_hole circle (at 2.54 11.43) (size 1.397 2.794) (drill 0.99822) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad 12 thru_hole circle (at 5.08 11.43) (size 1.397 2.794) (drill 0.99822) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad 13 thru_hole circle (at 7.62 11.43) (size 1.397 2.794) (drill 0.99822) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad 14 thru_hole circle (at 10.16 11.43) (size 1.397 2.794) (drill 0.99822) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad 15 thru_hole circle (at 12.7 11.43) (size 1.397 2.794) (drill 0.99822) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad 16 thru_hole circle (at 15.24 11.43) (size 1.397 2.794) (drill 0.99822) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad 17 thru_hole circle (at 17.78 11.43) (size 1.397 2.794) (drill 0.99822) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad 18 thru_hole circle (at 20.32 11.43) (size 1.397 2.794) (drill 0.99822) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad 19 thru_hole circle (at 22.86 11.43) (size 1.397 2.794) (drill 0.99822) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad 20 thru_hole circle (at 25.4 11.43) (size 1.397 2.794) (drill 0.99822) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad 21 thru_hole circle (at 25.4 -11.43) (size 1.397 2.794) (drill 0.99822) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad 22 thru_hole circle (at 22.86 -11.43) (size 1.397 2.794) (drill 0.99822) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad 23 thru_hole circle (at 20.32 -11.43) (size 1.397 2.794) (drill 0.99822) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad 24 thru_hole circle (at 17.78 -11.43) (size 1.397 2.794) (drill 0.99822) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad 25 thru_hole circle (at 15.24 -11.43) (size 1.397 2.794) (drill 0.99822) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad 26 thru_hole circle (at 12.7 -11.43) (size 1.397 2.794) (drill 0.99822) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad 27 thru_hole circle (at 10.16 -11.43) (size 1.397 2.794) (drill 0.99822) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad 28 thru_hole circle (at 7.62 -11.43) (size 1.397 2.794) (drill 0.99822) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad 29 thru_hole circle (at 5.08 -11.43) (size 1.397 2.794) (drill 0.99822) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad 30 thru_hole circle (at 2.54 -11.43) (size 1.397 2.794) (drill 0.99822) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad 31 thru_hole circle (at 0 -11.43) (size 1.397 2.794) (drill 0.99822) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad 32 thru_hole circle (at -2.54 -11.43) (size 1.397 2.794) (drill 0.99822) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad 33 thru_hole circle (at -5.08 -11.43) (size 1.397 2.794) (drill 0.99822) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad 34 thru_hole circle (at -7.62 -11.43) (size 1.397 2.794) (drill 0.99822) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad 35 thru_hole circle (at -10.16 -11.43) (size 1.397 2.794) (drill 0.99822) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad 36 thru_hole circle (at -12.7 -11.43) (size 1.397 2.794) (drill 0.99822) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad 37 thru_hole circle (at -15.24 -11.43) (size 1.397 2.794) (drill 0.99822) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad 38 thru_hole circle (at -17.78 -11.43) (size 1.397 2.794) (drill 0.99822) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad 39 thru_hole circle (at -20.32 -11.43) (size 1.397 2.794) (drill 0.99822) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad 40 thru_hole circle (at -22.86 -11.43) (size 1.397 2.794) (drill 0.99822) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
)