(module TSSOP28 (layer F.Cu) (tedit 5961E99F) (attr smd) (fp_text reference >NAME (at 0 -5.842) (layer F.SilkS) (effects (font (size 0.6096 0.6096) (thickness 0.127))) ) (fp_text value >VALUE (at 0 5.207) (layer F.SilkS) (effects (font (size 0.6096 0.6096) (thickness 0.127))) ) (fp_circle (center -2.794 -5.207) (end -2.667 -5.207) (layer F.SilkS) (width 0.254)) (fp_line (start -2.27584 4.5593) (end 2.27584 4.5593) (layer Dwgs.User) (width 0.127)) (fp_line (start 2.27584 4.5593) (end 2.27584 -5.2197) (layer Dwgs.User) (width 0.127)) (fp_line (start 2.27584 -5.2197) (end -2.27584 -5.2197) (layer Dwgs.User) (width 0.127)) (fp_line (start -2.27584 -5.2197) (end -2.27584 4.5593) (layer Dwgs.User) (width 0.127)) (fp_line (start -2.27584 -5.2197) (end 2.27584 -5.2197) (layer F.SilkS) (width 0.127)) (fp_line (start 2.27584 -5.2197) (end 2.27584 4.5593) (layer F.SilkS) (width 0.127)) (fp_line (start 2.27584 4.5593) (end -2.27584 4.5593) (layer F.SilkS) (width 0.127)) (fp_line (start -2.27584 4.5593) (end -2.27584 -5.2197) (layer F.SilkS) (width 0.127)) (pad 1 smd rect (at -2.921 -4.6228) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 2 smd rect (at -2.921 -3.9624) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 3 smd rect (at -2.921 -3.302) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 4 smd rect (at -2.921 -2.6416) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 5 smd rect (at -2.921 -1.9812) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 6 smd rect (at -2.921 -1.3208) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 7 smd rect (at -2.921 -0.6604) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 8 smd rect (at -2.92608 0) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 9 smd rect (at -2.921 0.6604) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 10 smd rect (at -2.921 1.3208) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 11 smd rect (at -2.921 1.9812) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 12 smd rect (at -2.921 2.6416) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 13 smd rect (at -2.921 3.302) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 14 smd rect (at -2.921 3.9624) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 15 smd rect (at 2.921 3.9624) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 16 smd rect (at 2.921 3.302) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 17 smd rect (at 2.921 2.6416) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 18 smd rect (at 2.921 1.9812) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 19 smd rect (at 2.921 1.3208) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 20 smd rect (at 2.921 0.6604) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 21 smd rect (at 2.92608 0) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 22 smd rect (at 2.921 -0.6604) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 23 smd rect (at 2.921 -1.3208) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 24 smd rect (at 2.921 -1.9812) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 25 smd rect (at 2.921 -2.6416) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 26 smd rect (at 2.921 -3.302) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 27 smd rect (at 2.921 -3.9624) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 28 smd rect (at 2.921 -4.6228) (size 0.79756 0.24892) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) )