(module TQFP32-5MM (layer F.Cu) (tedit 5961E8B2) (descr "TQFP - 32") (tags "TQFP - 32") (attr smd) (fp_text reference >NAME (at 0 -4.826) (layer F.SilkS) (effects (font (size 0.6096 0.6096) (thickness 0.127))) ) (fp_text value >VALUE (at 0 4.826 180) (layer F.SilkS) (effects (font (size 0.6096 0.6096) (thickness 0.127))) ) (fp_circle (center -3.175 -3.175) (end -2.921 -3.175) (layer F.SilkS) (width 0.254)) (fp_circle (center -3.175 -3.175) (end -3.048 -3.175) (layer F.SilkS) (width 0.254)) (fp_line (start -2.49936 2.49936) (end 2.49936 2.49936) (layer Dwgs.User) (width 0.254)) (fp_line (start 2.49936 2.49936) (end 2.49936 -2.49936) (layer Dwgs.User) (width 0.254)) (fp_line (start 2.49936 -2.49936) (end -2.49936 -2.49936) (layer Dwgs.User) (width 0.254)) (fp_line (start -2.49936 -2.49936) (end -2.49936 2.49936) (layer Dwgs.User) (width 0.254)) (fp_line (start -2.49936 2.49936) (end 2.49936 2.49936) (layer F.SilkS) (width 0.254)) (fp_line (start 2.49936 2.49936) (end 2.49936 -2.49936) (layer F.SilkS) (width 0.254)) (fp_line (start 2.49936 -2.49936) (end -2.49936 -2.49936) (layer F.SilkS) (width 0.254)) (fp_line (start -2.49936 -2.49936) (end -2.49936 2.49936) (layer F.SilkS) (width 0.254)) (pad 1 smd rect (at -3.49758 -1.74752) (size 1.143 0.254) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 2 smd rect (at -3.49758 -1.24968) (size 1.143 0.254) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 3 smd rect (at -3.49758 -0.7493) (size 1.143 0.254) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 4 smd rect (at -3.49758 -0.24892) (size 1.143 0.254) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 5 smd rect (at -3.49758 0.24892) (size 1.143 0.254) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 6 smd rect (at -3.49758 0.7493) (size 1.143 0.254) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 7 smd rect (at -3.49758 1.24968) (size 1.143 0.254) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 8 smd rect (at -3.49758 1.74752) (size 1.143 0.254) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 9 smd rect (at -1.74752 3.49758 90) (size 1.143 0.254) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 10 smd rect (at -1.24968 3.49758 90) (size 1.143 0.254) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 11 smd rect (at -0.7493 3.49758 90) (size 1.143 0.254) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 12 smd rect (at -0.24892 3.49758 90) (size 1.143 0.254) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 13 smd rect (at 0.24892 3.49758 90) (size 1.143 0.254) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 14 smd rect (at 0.7493 3.49758 90) (size 1.143 0.254) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 15 smd rect (at 1.24968 3.49758 90) (size 1.143 0.254) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 16 smd rect (at 1.74752 3.49758 90) (size 1.143 0.254) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 17 smd rect (at 3.49758 1.74752 180) (size 1.143 0.254) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 18 smd rect (at 3.49758 1.24968 180) (size 1.143 0.254) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 19 smd rect (at 3.49758 0.7493 180) (size 1.143 0.254) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 20 smd rect (at 3.49758 0.24892 180) (size 1.143 0.254) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 21 smd rect (at 3.49758 -0.24892 180) (size 1.143 0.254) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 22 smd rect (at 3.49758 -0.7493 180) (size 1.143 0.254) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 23 smd rect (at 3.49758 -1.24968 180) (size 1.143 0.254) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 24 smd rect (at 3.49758 -1.74752 180) (size 1.143 0.254) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 25 smd rect (at 1.74752 -3.49758 270) (size 1.143 0.254) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 26 smd rect (at 1.24968 -3.49758 270) (size 1.143 0.254) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 27 smd rect (at 0.7493 -3.49758 270) (size 1.143 0.254) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 28 smd rect (at 0.24892 -3.49758 270) (size 1.143 0.254) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 29 smd rect (at -0.24892 -3.49758 270) (size 1.143 0.254) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 30 smd rect (at -0.7493 -3.49758 270) (size 1.143 0.254) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 31 smd rect (at -1.24968 -3.49758 270) (size 1.143 0.254) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 32 smd rect (at -1.74752 -3.49758 270) (size 1.143 0.254) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) )