(module MICRO-SDCARD (layer F.Cu) (tedit 200000)
  (descr "MICROSD CARD FOOTPRINT")
  (tags "MICROSD CARD FOOTPRINT")
  (attr smd)
  (fp_text reference >NAME (at 0 -6.35) (layer F.SilkS)
    (effects (font (size 0.6096 0.6096) (thickness 0.127)))
  )
  (fp_text value >VALUE (at 0 2.54) (layer F.SilkS)
    (effects (font (size 0.6096 0.6096) (thickness 0.127)))
  )
  (fp_line (start 5.08 7.62) (end 5.08 -7.3787) (layer F.SilkS) (width 0.127))
  (fp_line (start 5.08 -7.3787) (end -5.9182 -7.3787) (layer F.SilkS) (width 0.127))
  (fp_line (start -5.9182 -1.97866) (end -5.51942 -1.57988) (layer F.SilkS) (width 0.127))
  (fp_line (start -5.51942 -1.57988) (end -5.51942 0.21844) (layer F.SilkS) (width 0.127))
  (fp_line (start -5.51942 0.21844) (end -5.9182 0.61976) (layer F.SilkS) (width 0.127))
  (fp_line (start -5.9182 0.61976) (end -5.9182 1.61798) (layer F.SilkS) (width 0.127))
  (fp_line (start -5.9182 1.61798) (end -4.91998 2.61874) (layer F.SilkS) (width 0.127))
  (fp_line (start -4.91998 2.61874) (end -4.91998 7.62) (layer F.SilkS) (width 0.127))
  (fp_line (start -4.91998 7.62) (end 5.08 7.62) (layer F.SilkS) (width 0.127))
  (fp_line (start -5.9182 -7.3787) (end -5.9182 -1.97866) (layer F.SilkS) (width 0.127))
  (pad CD/D smd rect (at -2.51968 5.31876) (size 0.84836 3.24866) (layers F.Cu B.Mask)
    (solder_mask_margin 0.1016))
  (pad CLK smd rect (at 0.77978 5.31876) (size 0.84836 3.24866) (layers F.Cu B.Mask)
    (solder_mask_margin 0.1016))
  (pad CMD smd rect (at -1.41986 5.31876) (size 0.84836 3.24866) (layers F.Cu B.Mask)
    (solder_mask_margin 0.1016))
  (pad DAT0 smd rect (at 2.97942 5.31876) (size 0.84836 3.24866) (layers F.Cu B.Mask)
    (solder_mask_margin 0.1016))
  (pad DAT1 smd rect (at 4.07924 5.31876) (size 0.84836 3.24866) (layers F.Cu B.Mask)
    (solder_mask_margin 0.1016))
  (pad DAT2 smd rect (at -3.6195 5.31876) (size 0.84836 3.24866) (layers F.Cu B.Mask)
    (solder_mask_margin 0.1016))
  (pad GND smd rect (at 1.8796 5.51942 180) (size 0.84836 3.74904) (layers F.Cu B.Mask)
    (solder_mask_margin 0.1016))
  (pad VCC smd rect (at -0.3175 5.51942) (size 0.84836 3.74904) (layers F.Cu B.Mask)
    (solder_mask_margin 0.1016))
)