(module DFN-6-3X3-HTU21D (layer F.Cu) (tedit 5963A5C9) (descr "6-PIN DUAL FLAT NO-LEAD (DFN) W/ CENTER PAD (3.0 X 3.0 MM) - DESIGNED FOR HTU21D") (tags "6-PIN DUAL FLAT NO-LEAD (DFN) W/ CENTER PAD (3.0 X 3.0 MM) - DESIGNED FOR HTU21D") (attr smd) (fp_text reference >NAME (at 0 -2.286) (layer F.SilkS) (effects (font (size 0.6096 0.6096) (thickness 0.127))) ) (fp_text value >VALUE (at 0 2.286) (layer F.SilkS) (effects (font (size 0.6096 0.6096) (thickness 0.127))) ) (fp_line (start 1.4986 -1.4986) (end 1.4986 1.4986) (layer Dwgs.User) (width 0.127)) (fp_line (start 1.4986 1.4986) (end -1.4986 1.4986) (layer Dwgs.User) (width 0.127)) (fp_line (start -1.4986 -1.4986) (end -1.4986 1.4986) (layer Dwgs.User) (width 0.127)) (fp_line (start 1.4986 -1.4986) (end -1.4986 -1.4986) (layer Dwgs.User) (width 0.127)) (fp_line (start -1.4986 -1.6256) (end 1.4986 -1.6256) (layer F.SilkS) (width 0.2032)) (fp_line (start -0.49784 -1.19888) (end 0.49784 -1.19888) (layer Dwgs.User) (width 0.127)) (fp_line (start 0.49784 -1.19888) (end 0.49784 -0.49784) (layer Dwgs.User) (width 0.127)) (fp_line (start 0.49784 -0.49784) (end -0.49784 -0.49784) (layer Dwgs.User) (width 0.127)) (fp_line (start -0.49784 -0.49784) (end -0.49784 -1.19888) (layer Dwgs.User) (width 0.127)) (fp_line (start 1.4986 1.6256) (end -1.4986 1.6256) (layer F.SilkS) (width 0.2032)) (fp_poly (pts (xy -0.6985 -1.24968) (xy 0.7493 -1.24968) (xy 0.7493 0.79756) (xy 0.29972 1.24968) (xy -0.6985 1.24968) (xy -0.6985 -1.24968) ) (layer F.Cu) (width 0.127)) (fp_poly (pts (xy -0.54864 -1.04902) (xy 0.54864 -1.04902) (xy 0.54864 0.6477) (xy 0.09906 1.09982) (xy -0.54864 1.09982) (xy -0.54864 -1.04902) ) (layer F.Paste) (width 0.127)) (fp_poly (pts (xy -0.7747 -1.32334) (xy -0.7747 1.29794) (xy 0.37338 1.29794) (xy 0.82296 0.84836) (xy 0.82296 -1.32334) (xy -0.7747 -1.32334) ) (layer F.Mask) (width 0.127)) (fp_circle (center 1.778 1.7272) (end 1.778 1.4732) (layer F.SilkS) (width 0)) (pad 7 smd rect (at 0 0) (size 0.19812 0.19812) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad DATA smd rect (at 1.4986 0.99822 270) (size 0.49784 0.79756) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad GND smd rect (at 1.4986 0 270) (size 0.49784 0.79756) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad NC@1 smd rect (at -1.4986 -0.99822 270) (size 0.49784 0.79756) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad NC@6 smd rect (at 1.4986 -0.99822 270) (size 0.49784 0.79756) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad SCK smd rect (at -1.4986 0.99822 270) (size 0.49784 0.79756) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad VDD smd rect (at -1.4986 0 270) (size 0.49784 0.79756) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) )