(module SD-MMC-CARD (layer F.Cu) (tedit 200000) (descr "SD MMC CARD FOOTPRINT") (tags "SD MMC CARD FOOTPRINT") (attr smd) (fp_text reference >NAME (at 0 -18.3388) (layer F.SilkS) (effects (font (size 0.6096 0.6096) (thickness 0.127))) ) (fp_text value >VALUE (at 0 14.605) (layer F.SilkS) (effects (font (size 0.6096 0.6096) (thickness 0.127))) ) (fp_line (start -12.7 13.97) (end 11.29792 13.97) (layer F.SilkS) (width 0.2032)) (fp_line (start -12.7 -14.02842) (end -12.7 13.97) (layer F.SilkS) (width 0.2032)) (fp_line (start -12.7 13.97) (end -12.7 -13.97) (layer F.SilkS) (width 0.2032)) (fp_line (start -12.7 -13.97) (end -8.89 -17.78) (layer F.SilkS) (width 0.2032)) (fp_line (start -8.89 -17.78) (end 11.43 -17.78) (layer F.SilkS) (width 0.2032)) (fp_line (start 11.43 -17.78) (end 11.43 13.97) (layer F.SilkS) (width 0.2032)) (fp_line (start 11.43 13.97) (end -12.7 13.97) (layer F.SilkS) (width 0.2032)) (pad 1 smd rect (at -8.0137 -14.71168 180) (size 1.74752 5.99948) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 2 smd rect (at -5.46354 -14.70152 180) (size 1.74752 5.99948) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 3 smd rect (at -2.86766 -14.70152 180) (size 1.74752 5.99948) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 4 smd rect (at -0.33782 -14.70152 180) (size 1.74752 5.99948) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 5 smd rect (at 2.19456 -14.70152 180) (size 1.74752 5.99948) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 6 smd rect (at 4.75996 -14.70152 180) (size 1.74752 5.99948) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 7 smd rect (at 7.15772 -14.70152 180) (size 1.64846 5.99948) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 8 smd rect (at 9.15924 -14.70152 180) (size 1.24968 5.99948) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 9 smd rect (at -10.79754 -12.02944 180) (size 1.99898 4.99872) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.1016)) )