f8ffc2c5
 mahmoudrabia
first commit
|
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
|
(module MICRO-SDCARD (layer F.Cu) (tedit 200000)
(descr "MICROSD CARD FOOTPRINT")
(tags "MICROSD CARD FOOTPRINT")
(attr smd)
(fp_text reference >NAME (at 0 -6.35) (layer F.SilkS)
(effects (font (size 0.6096 0.6096) (thickness 0.127)))
)
(fp_text value >VALUE (at 0 2.54) (layer F.SilkS)
(effects (font (size 0.6096 0.6096) (thickness 0.127)))
)
(fp_line (start 5.08 7.62) (end 5.08 -7.3787) (layer F.SilkS) (width 0.127))
(fp_line (start 5.08 -7.3787) (end -5.9182 -7.3787) (layer F.SilkS) (width 0.127))
(fp_line (start -5.9182 -1.97866) (end -5.51942 -1.57988) (layer F.SilkS) (width 0.127))
(fp_line (start -5.51942 -1.57988) (end -5.51942 0.21844) (layer F.SilkS) (width 0.127))
(fp_line (start -5.51942 0.21844) (end -5.9182 0.61976) (layer F.SilkS) (width 0.127))
(fp_line (start -5.9182 0.61976) (end -5.9182 1.61798) (layer F.SilkS) (width 0.127))
(fp_line (start -5.9182 1.61798) (end -4.91998 2.61874) (layer F.SilkS) (width 0.127))
(fp_line (start -4.91998 2.61874) (end -4.91998 7.62) (layer F.SilkS) (width 0.127))
(fp_line (start -4.91998 7.62) (end 5.08 7.62) (layer F.SilkS) (width 0.127))
(fp_line (start -5.9182 -7.3787) (end -5.9182 -1.97866) (layer F.SilkS) (width 0.127))
(pad CD/D smd rect (at -2.51968 5.31876) (size 0.84836 3.24866) (layers F.Cu B.Mask)
(solder_mask_margin 0.1016))
(pad CLK smd rect (at 0.77978 5.31876) (size 0.84836 3.24866) (layers F.Cu B.Mask)
(solder_mask_margin 0.1016))
(pad CMD smd rect (at -1.41986 5.31876) (size 0.84836 3.24866) (layers F.Cu B.Mask)
(solder_mask_margin 0.1016))
(pad DAT0 smd rect (at 2.97942 5.31876) (size 0.84836 3.24866) (layers F.Cu B.Mask)
(solder_mask_margin 0.1016))
(pad DAT1 smd rect (at 4.07924 5.31876) (size 0.84836 3.24866) (layers F.Cu B.Mask)
(solder_mask_margin 0.1016))
(pad DAT2 smd rect (at -3.6195 5.31876) (size 0.84836 3.24866) (layers F.Cu B.Mask)
(solder_mask_margin 0.1016))
(pad GND smd rect (at 1.8796 5.51942 180) (size 0.84836 3.74904) (layers F.Cu B.Mask)
(solder_mask_margin 0.1016))
(pad VCC smd rect (at -0.3175 5.51942) (size 0.84836 3.74904) (layers F.Cu B.Mask)
(solder_mask_margin 0.1016))
)
|