f8ffc2c5
 mahmoudrabia
first commit
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(module PSP_CONNECTOR (layer F.Cu) (tedit 200000)
(descr "ZIF PSP CONNECTOR")
(tags "ZIF PSP CONNECTOR")
(attr smd)
(fp_text reference >NAME (at 0.889 -24.13) (layer F.SilkS)
(effects (font (size 0.6096 0.6096) (thickness 0.127)))
)
(fp_text value >VALUE (at 1.143 -2.54) (layer F.SilkS)
(effects (font (size 0.6096 0.6096) (thickness 0.127)))
)
(pad . smd rect (at 4.39928 -25.2984 180) (size 0 0) (layers F.Cu B.Mask)
(solder_mask_margin 0.1016))
(pad AVDD smd rect (at 0.99822 -5.99948 90) (size 0.254 1.27) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad AVDD smd rect (at 0.99822 -5.4991 270) (size 0.254 1.27) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad B0 smd rect (at 0.99822 -12.99972 270) (size 0.254 1.27) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad B1 smd rect (at 0.99822 -12.49934 270) (size 0.254 1.27) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad B2 smd rect (at 0.99822 -11.99896 90) (size 0.254 1.27) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad B3 smd rect (at 0.99822 -11.49858 270) (size 0.254 1.27) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad B4 smd rect (at 0.99822 -10.9982 270) (size 0.254 1.27) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad B5 smd rect (at 0.99822 -10.49782 270) (size 0.254 1.27) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad B6 smd rect (at 0.99822 -9.99998 90) (size 0.254 1.27) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad B7 smd rect (at 0.99822 -9.4996 270) (size 0.254 1.27) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad CK smd rect (at 0.99822 -8.49884 270) (size 0.254 1.27) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad DISP smd rect (at 0.99822 -7.99846 90) (size 0.254 1.27) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad G0 smd rect (at 0.99822 -16.99768 270) (size 0.254 1.27) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad G1 smd rect (at 0.99822 -16.49984 270) (size 0.254 1.27) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad G2 smd rect (at 0.99822 -15.99946 90) (size 0.254 1.27) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad G3 smd rect (at 0.99822 -15.49908 270) (size 0.254 1.27) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad G4 smd rect (at 0.99822 -14.9987 270) (size 0.254 1.27) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad G5 smd rect (at 0.99822 -14.49832 270) (size 0.254 1.27) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad G6 smd rect (at 0.99822 -13.99794 90) (size 0.254 1.27) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad G7 smd rect (at 0.99822 -13.49756 270) (size 0.254 1.27) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad GND smd rect (at 0.99822 -22.9997 270) (size 0.254 1.27) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad GND2 smd rect (at 0.99822 -22.49932 270) (size 0.254 1.27) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad GND3 smd rect (at 0.99822 -8.99922 270) (size 0.254 1.27) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad GND4 smd rect (at 4.19862 -25.2984) (size 2.19964 1.79832) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad GND5 smd rect (at 4.19862 -1.29794) (size 2.19964 1.79832) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad HSYN smd rect (at 0.99822 -7.49808 270) (size 0.254 1.27) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad NC smd rect (at 0.99822 -6.49986 270) (size 0.254 1.27) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad NC2 smd rect (at 0.99822 -4.99872 270) (size 0.254 1.27) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad R0 smd rect (at 0.99822 -20.99818 270) (size 0.254 1.27) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad R1 smd rect (at 0.99822 -20.4978 270) (size 0.254 1.27) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad R2 smd rect (at 0.99822 -19.99996 90) (size 0.254 1.27) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad R3 smd rect (at 0.99822 -19.49958 270) (size 0.254 1.27) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad R4 smd rect (at 0.99822 -18.9992 270) (size 0.254 1.27) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad R5 smd rect (at 0.99822 -18.49882 270) (size 0.254 1.27) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad R6 smd rect (at 0.99822 -17.99844 90) (size 0.254 1.27) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad R7 smd rect (at 0.99822 -17.49806 270) (size 0.254 1.27) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad TEST smd rect (at 0.99822 -4.49834 270) (size 0.254 1.27) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad TEST smd rect (at 0.99822 -3.99796 90) (size 0.254 1.27) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad TEST smd rect (at 0.99822 -3.49758 270) (size 0.254 1.27) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad VCC smd rect (at 0.99822 -21.99894 90) (size 0.254 1.27) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad VCC2 smd rect (at 0.99822 -21.49856 270) (size 0.254 1.27) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
(pad VSYN smd rect (at 0.99822 -6.9977 270) (size 0.254 1.27) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1016))
)
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